8 Layer Immersion Gold Impedance PCB Board Prototype FR4 S1150G

8-layer immersion gold impedance board PCB board prototype FR4 S1150G

8-layer PCB circuit board

PCB Thickness Capability: The thickness of PCB can range from 0.2 to 4.0mm. However, boards thinner than 0.2mm or thicker than 4mm require review. If the board thickness is 0.6mm or less, the PCB cannot have a HASL surface finish.

Copper thickness: The minimum thickness of the inner and outer base copper layers can reach 0.3/0.5oz, the maximum thickness can reach 3oz, and the advanced level can reach 4-6oz.

Bend and Twist Tolerance: The PCB has a 0.075% bend and twist tolerance.

Minimum hole size: The minimum hole size of the PCB can be 0.15mm, but boards with holes smaller than 0.15mm need to be reviewed.

HDI minimum drilling capacity: PCB minimum drilling size is 0.08-0.10mm.

PCB trace/clearance capability: PCB trace/clearance capability up to 3mil (0.075mm).

PCB Outline Method: PCB Outline can use routing, V-CUT or punching.

Solder Mask Thickness Capability: PCBs can have a standard solder mask thickness of 15-20um or a premium thickness of 35um.

Minimum solder mask bridge width capability: Minimum solder mask bridge width capability is 4 million for green and 4.8 million for other colors.

Solder mask filling ability: PCB can have solder mask filling holes with a diameter of 0.1-0.5mm.

Solder mask color: Solder mask can be green, matte green, blue, matte blue, black, matte black, yellow, red, white or other colors.

PCB silk screen printing: PCB silk screen printing can be white, black, or other colors can be selected according to requirements.

Shenzhen Jieteng Circuit Co., Ltd.

Specializing in the production of various types of PCB circuit boards

Immersion Gold PCB Board Prototype

8 Layer PCB Board Prototype

1OZ PCB Board Assembly

8 Layer Immersion Gold Impedance PCB Board Prototype FR4 S1150G Images